TTM Technologies, Inc. Announces Upcoming Conference Participation

COSTA MESA, Calif., May 13, 2019 (GLOBE NEWSWIRE) -- TTM Technologies, Inc. (NASDAQ:TTMI), a leading global printed circuit board (PCB) and radio frequency (“RF”) components manufacturer, today announced that members of its management team will present at the following investor conferences:

  • The J.P. Morgan Global Technology, Media and Communications Conference in Boston at the Westin Boston Waterfront Hotel on May 14, 2019 at 9:20am Eastern Time;
  • The Barclays High Yield Bond and Syndicated Loan Conference in Colorado Springs, Colorado at the Broadmoor Hotel on June 6, 2019 at 11:00 am Mountain Time;
  • The Stifel Cross Sector Insight Conference in Boston at the Intercontinental Hotel on June 11, 8:35am Eastern Time;
  • The Nasdaq Investor Conference in London at the Mayfair Hotel on June 13, 3:00pm British Time.

The presentations will be webcast live on the company’s website,, and a replay will be accessible for a limited time following the events.

About TTM
TTM Technologies, Inc. is a leading global printed circuit board manufacturer, focusing on quick-turn and technologically advanced PCBs, backplane assemblies and electro-mechanical solutions as well as a global designer and manufacturer of RF and microwave components and assemblies. TTM stands for time-to-market, representing how TTM's time-critical, one-stop manufacturing services enable customers to shorten the time required to develop new products and bring them to market. Additional information can be found at

Sameer Desai,
Senior Director, Corporate
Development & Investor Relations

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Source: TTM Technologies