TTM Technologies, Inc. Announces Upcoming Conference Participation

SANTA ANA, Calif., May 10, 2021 (GLOBE NEWSWIRE) -- TTM Technologies, Inc. (NASDAQ:TTMI), a leading global printed circuit board (PCB) and radio frequency (“RF”) components and assemblies manufacturer, today announced that members of its management team will attend the following virtual investor conferences:

  • The Goldman Sachs Credit and Leveraged Finance Conference on May 17th with a presentation at 2:55pm Eastern Time,
  • The Needham Technology and Media Conference on May 18th with a presentation at 3:00pm Eastern Time,
  • The JP Morgan Global Technology, Media and Communications conference on May 24th,
  • The Barclays High Yield Bond and Syndicated Loan Conference on May 26th,
  • The Craig-Hallum Institutional Investor Conference on June 2nd,
  • The UBS Global Industrials and Transportation Conference on June 8th with a presentation at 4:00 pm Eastern Time,
  • The Baird Global Consumer, Technology & Services Conference on June 9th with a presentation at 12:50pm Eastern Time; and
  • The Stifel Cross Sector Insight Conference on June 10th with a presentation at 12:00 pm Eastern Time.

All presentations will be webcast live on the company’s website,, and a replay will be accessible for a limited time following the events.

About TTM
TTM Technologies, Inc. is a leading global printed circuit board manufacturer, focusing on quick-turn and technologically advanced PCBs and backplane assemblies, and a global designer and manufacturer of RF and microwave components and assemblies. TTM stands for time-to-market, representing how TTM's time-critical, one-stop manufacturing services enable customers to shorten the time required to develop new products and bring them to market. Additional information can be found at

Sameer Desai,
Senior Director, Corporate Development & Investor Relations

Primary Logo

Source: TTM Technologies