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TTM Technologies, Inc. Announces Upcoming Conference Participation

COSTA MESA, Calif., May 15, 2017 (GLOBE NEWSWIRE) -- TTM Technologies, Inc. (NASDAQ:TTMI), a leading global printed circuit board (PCB) manufacturer, today announced that members of its management team will present at the following investor conferences:

  • The J.P. Morgan Technology, Media, Telecom Conference in Boston at the Westin Copley Place on May 24th, 2017 at 8:40am Eastern Time;
  • The Stifel Technology, Internet, Media Conference in San Francisco at the Fairmount Hotel on June 5th, 2017 at 3:00pm Pacific Time;
  • The Needham Automotive Technology Conference in New York at the Needham Offices at 445 Park Avenue on June 6th, 2017;
  • The Barclays High Yield Bond & Syndicated Loan Conference in Colorado Springs at the Broadmoor Hotel on June 8th at 8:50am Mountain Time; and
  • The Goldman Sachs Leveraged Finance Conference in Rancho Palos Verdes at the Terranea Resort on June 20th at 4:25pm Pacific Time.

All presentations will be webcast live on the company’s website,, and a replay will be accessible for a limited time following the events.

About TTM
TTM Technologies, Inc. is a leading global printed circuit board manufacturer, focusing on quick-turn and volume production of technologically advanced PCBs, backplane assemblies and electro-mechanical solutions. TTM stands for time-to-market, representing how TTM's time-critical, one-stop manufacturing services enable customers to shorten the time required to develop new products and bring them to market. Additional information can be found at

Sameer Desai,
Senior Director, Corporate
Development & Investor Relations

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